搜索结果: 1-14 共查到“电子科学与技术 Cu”相关记录14条 . 查询时间(0.062 秒)
日本东北大学研究生院工学研究科智能元件材料学专业教授小池淳一的研究小组开发出了用于氧化物半导体TFT驱动的液晶面板、基于Cu-Mn合金的布线工艺，并在有源矩阵型显示器国际学会“AM-FPD10”（2010年7月5～7日，在东京工业大学举行）上发表了演讲（演讲序号：4-2）。与目前液晶面板中使用的Al布线相比，Cu布线的电阻要低1/2左右，因而可缩小面板布线的RC延迟。该工艺主要面向大尺寸液晶面板“...
中子活化Cu样品“跑兔”装置
“跑兔”系统 中子活化分析 激光聚变
2009/8/21
针对惯性约束聚变（ICF）实验装置上中子活化Cu样品的传递问题，设计并研制了“跑兔”装置，解决了“兔子”的顺畅传输、减速、定位、缓冲等问题。实验验证结果表明，“兔子”运动特性的实验曲线与理论模拟曲线吻合得很好，“兔子”可在1.12 s的时间范围内顺利地传输到14.3 m远的指定位置，平均速度为12.8 m/s，完全满足Cu样品的活化分析要求。
形变时效工艺对低铍Cu-Ni-Be合金力学性能和电导率的影响
Cu-Ni-Be合金 形变时效 力学性能 电导率
2011/1/14
运用正交设计研究形变时效工艺(冷变形量、时效温度和时效时间)对低铍含量Cu-Ni-Be合金力学性能和电导率的影响，并通过光学显微镜、扫描电镜和透射电镜对其显微组织进行分析。研究结果表明：在形变时效处理的3个主要工艺参数中，时效时间对抗拉强度、屈服强度和相对电导率的影响最大，时效温度次之，冷变形量最小；合金在经过37.5%冷变形的轧制后，在470 ℃时效2 h，γ″析出物细小且弥散分布在基体中，合金...
大规模集成电路用高强度高导电引线框架材料Cu-Cr-Zr合金的研究
集成电路 引线 Cu-Cr-Zr合金
2008/10/30
首先研究了时效温度、时间及时效前变形量对合金时效后的组织与性能的影响，结果表明：合金在600℃时效时可获得较高的导电性；而在450-470℃温度范围内时效时可获得较高的显微硬度；合金时效，析出相为单质Cr和Cu4Zr，且呈细小弥散分布。合金实效后再加以冷变形可提高合金的显微硬度，而导电率略有下降。本课题借助于Cu-Cr-Zr-Mg合金时效过程中导电率与析出相间的内在关系建立了合金导电率与体积分数...
掺氟对Y-Ba-Cu-O高温超导体电子结构的影响
Y-Ba-Cu-O超导体 氟掺杂 态密度
2008/8/15
采用Recursion方法计算了不同掺氟量和不同替代位置下Y-Ba-Cu-O的电子结构,
从掺氟Y-Ba-Cu-O各晶位的态密度(DOS), 可进一步得到Fermi能EF、
Fermi能级处的态密度N(EF)以及各晶位原子价等重要数据. 各模型的计算
结果表明, 掺入氟后引起CuO2平面上Cu的原子价升高和O的价位变得更负,
使Cu位空穴数目增加和O位空穴数目减少, 且以后者的变化为主. ...
脉冲激光激发Cu等离子体温度的玻耳兹曼方法测量研究
脉冲激光 Cu等离子体温度 CCD探测 玻耳兹曼分布
2008/4/30
以YAG调Q脉冲激光为光源，以金属Cu作为样品，使用CCD技术采集Cu等离子体瞬态光谱，用玻耳兹曼分布法对激光等离子体的温度进行了测量。由测量结果可知，当激光脉冲能量为0.1J时，测量的Cu谱为原子激发谱，等离子体温度为14063K。作为对比，还用同样方法测量了交流电弧激发的Cu等离子体温度。所建立的测温方法对于研究激光与物质的相互作用有重要应用前景。
期刊信息
篇名
High resolution electron microscopy studies of martensite around Xs precipitates in a Cu-Al-Ni-Mn-Ti shape memory alloy
语种
英文
撰写或编译
撰写
作者
H.Y.Peng,Y.D.Yu and D.X.Li
第一作者单位
Institute of Metal R...
Comparative Study of Statistical Distributions in Electromigration-Induced Failures of Al/Cu Thin-Film Interconnects
Statistical Distributions Electromigration-Induced Failures Al/Cu Thin-Film Interconnects
2010/12/15
In electromigration failure studies, it is in general assumed that electromigration-induced failures may be adequately modelled by a log-normal distribution. Further to this, it has been argued that a...
Relationship Among Preparation, Structure and Superconductivity in Ti-Ca-Ba-Cu-O Compounds
Ti-Ca-Ba-Cu-O Compounds Preparation Structure Superconductivity
2010/12/16
Analysis of a comprehensive set of experimental results has proven the substantial effect of the precise preparation conditions upon the structure and superconducting parameters of Ti-Ca-Ba-Cu-O sampl...
The Properties of Screen Printed (Bi,Pb)-Sr-Ca-Cu-O Thick Films Based On Decomposed Oxalate Powders
Screen Printed (Bi,Pb)-Sr-Ca-Cu-O Thick Films Decomposed Oxalate Powders
2010/12/16
The significance of powder and paste characteristics was studied in order to improve the morphology and structure of superconducting (Bi,Pb)-Sr-Ca-Cu-O screen printed thick films. Powder with nominal ...
The Textural Effect of Cu Doping and the Electronic Effect of Ti, Zr and Ge Dopings Upon the Physical Properties of In2O3 and Sn-Doped In2O3 Ceramics
Cu In2O3 Sn-Doped In2O3 Ceramics
2010/12/16
The electronic properties of Cu-, Ti-, Zr-, and Ge-doped In2O3 (IO) and ITO (Sn-doped In2O3) ceramics are investigated. We distinguish the different effect of Cu doping (so called the “textural effect...
Superconducting Thick-Films From a Y-Ba-Cu-O Precursor
thick film super conduction high temperature superconductors
2010/12/16
We have prepared screen-printed films of the Y-Ba-Cu-O compound starting from a spray-pyrolysis precursor powder. BeO ceramic substrates are confirmed to be inert with respect to the film up to about ...
Screen-Printed Superconducting Y-Ba-Cu-O Thick Films on Various Substrates
the Y-Ba-Cu-O system the substrate material the superconducting properties of the films
2010/12/21
Superconducting thick films of the Y-Ba-Cu-O system prepared by screen-printing and sintering on different substrates were investigated to study the effect of the substrate material on the superconduc...
Electrical Properties of RF Sputtered NiCr Thin Film Resistors With Cu Contacts
Electrical Properties RF Sputtered NiCr Thin Film Resistors Cu Contacts
2010/12/23
Investigations on RF sputtered NiCr thin film resistors, fabricated using Cu as conductor metallization, were made. The contact resistance characteristics, resistor film characteristics and TCR of the...