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Reconstructing buildings in 3D has been a challenging research topic for at least ten years, and will be in future as long as acquisition systems are improving and model requirements are increasing. D...
Terrestrial Laser Scanners are well suited for the acquisition of data for subsequent geometric modeling. Modern phase shift laser scanners allow the measuring of point clouds with very high point den...
The overall project is to create a system that automatically tests the internal components of Xilinx Virtex 4 LX200 device, while the device is running in a thermal chamber at temperatures that stress...
Parking is an ever-growing challenge in metropolitans around the world as the number of cars is continually increasing. Parking availability, in turn, is one of the most significant challenges to the ...
Bondig technique developed by CII-Honeywell Bull. The paper describes the geometry of bonding pads at the chip level, the design and realization of the corresponding high density 35 mm tape and the in...
High density packaging of semiconductor devices is necessary for high performance in compact electronic systems. But the assembly technology must also remain cost attractive. Through the development ...

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