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A New Bonding Process for Ceramics.
The Solid Phase Bonding of Gold to Metals.
Gold Bonding Wire for Semiconductor Applications
Gold Bonding Wire Semiconductor Applications
2009/7/30
Gold Bonding Wire for Semiconductor Applications.
Diffusion Bonding of Gold
Bonding Gold
2009/7/29
Gold has a low modulus and does not form an oxide skin when heated in the air. Added to this is its rapid self-diffusion characteristic and these three properties together make this metal suitable for...
Fine gold wires with diameters down to 15μm are used for bonding semiconductor devices. Increasingminiaturization of electronic circuits calls for smaller wire diameters. This requires the development...