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Advances in hydrogels based on dynamic covalent bonding and prospects for its biomedical application
Dynamic covalent bondAdvanced techniques Preparation Application
2024/1/19
In the past few decades, hydrogels based on dynamic covalent bonding (DCB) have attracted extensive attention and exploration with the rapid development of polymer science and life science disciplines...
High-strength and self-healable poly (acrylic acid) /chitosan hydrogel with organic-inorganic hydrogen bonding networks
Self-healing hydrogel Hydrogen bonding Organic-inorganic
2023/12/8
Bentonite?is a natural clay mineral with high cationic exchange properties and plays an important role in organic-inorganic composite hydrogels. We report an organic-inorganic cross-linked self-healin...
Self-Healable and Super-Tough Double-Network Hydrogel Fibers from Dynamic Acylhydrazone Bonding and Supramolecular Interactions
hydrogel fiber iota carrageenan dynamic covalent bond double network self-healing
2023/11/30
Macroscopic hydrogel fibers are highly desirable for smart textiles, but the fabrication of self-healable and super-tough covalent/physical double-network hydrogels is rarely reported. Herein, copolym...
Low-cost electrochemical filtration carbon membrane prepared from coal via self-bonding
Electrochemical filtration carbon membrane Caking coal Self-bonding Organic pollutants Oxidation mechanism
2023/6/19
Electrochemical filtration membranes are highly effective for wastewater treatment. However, their relatively high production cost may limit their large-scale production and industrial application. In...
2017第五届3D集成低温接合国际研讨会（2017 5th International Workshop on Low Temperature Bonding for 3D Integration）(LTB-3D)
第五届 3D集成低温接合 国际研讨会
2017/3/30
This workshop will focus on low-temperature bonding technologies which realize novel device structure by heterogeneous material and device integration and lead to entirely new manufacturing approaches...
The contribution contains results of bonded joints strength tests. The tests were carried out according to the modified standard ČSN EN 1465 (66 8510):2009. The spruce three-ply wood of 4 mm thic...
Synthesis and characterization by infrared spectroscopy of hydantoin-based bonding agents, used in composite propellants
Hydantoin Synthesis Characterization MIR Composite propellant
2010/10/25
Reactions to obtain hydantoin derivatives were carried out with 5,5-dimethylhydantoin and short-chain aldehydes. Monitoring of the reactions was performed using qualitative mid-infrared spectroscopy (...
Physical Properties and Wood Bonding Performance of Polyvinyl Alcohol with Addition of Montmorillonite
montmorillonite PVA heat resistance dynamic viscoelastic property wood bonding performance
2009/11/23
To improve the heat resistance of an aqueous vinyl polymer solution-isocyanate adhesive (API), we examined the film properties and the wood bonding performance of polyvinyl alcohol (PVA), which is gen...
A Prototype of Knowledge-Based System for Fault Diagnosis in Automatic Wire Bonding Machine
Semiconductor industry Automatic wire bond machine Knowledge-based system Troubleshooting
2009/9/30
In the modern world, computing is essential in all aspects of manufacturing activity. Computers have brought to life terms like artificial intelligence, and have played a critical role in reinvention ...
Adhesive Bonding Techniques in Hybrid Structures Made from Fibre Reinforced Polymeric Composites and Concrete
Fibre reinforced polymeric composites (FRP) concrete adhesive hybrid structures bonding techniques
2010/8/18
Mechanical joining techniques are used in construction industry all over the world on a daily basis. A further method of joining has proven to be highly successful – adhesive bonding. Known for thousa...
A New Bonding Process for Ceramics.
The Solid Phase Bonding of Gold to Metals.
The Bonding of Gold and Gold Alloys to Non-Metallic Materials
Gold Gold Alloys Non-Metallic Materials
2009/7/30
The Bonding of Gold and Gold Alloys to Non-Metallic Materials.
Gold Bonding Wire for Semiconductor Applications
Gold Bonding Wire Semiconductor Applications
2009/7/30
Gold Bonding Wire for Semiconductor Applications.
Diffusion Bonding of Gold
Bonding Gold
2009/7/29
Gold has a low modulus and does not form an oxide skin when heated in the air. Added to this is its rapid self-diffusion characteristic and these three properties together make this metal suitable for...