搜索结果: 1-7 共查到“电子科学与技术 ICs”相关记录7条 . 查询时间(0.086 秒)
Design of High-Speed CMOS Ics for 10 Gbit/s Optical Communication System
Design CMOS Ics Optical Communication System
2010/7/15
In this paper, the intrinsic disadvantages of the nowadays low-cost deep-submicron digital CMOS technologies in respect of the design of high-speed optical communication (OC)
systems front-end integr...
A 30 Gb/s parallel optic-fiber receiver structure is presented. Parallel receiver amplifiers of 12 channels have been designed using TSMC 0.25 μm CMOS technology and for single-channel bit rate of 2.5...
In this paper, progress in compound semiconductor devices and ICs is reviewed.Emphasis is laid on the status of the research and development in our institute in the areas such as GaAs very high speed ...
SiGe Bipolar ICs for 40 Gb/s Fiber-Optic TDM Transmission Systems
SiGe Bipolar ICs 40 Gb/s Fiber-Optic TDM Transmission Systems
2010/7/15
Today, commercial time-division multiplexing (TDM) systems for long-haul optical-fiber links are running at 2.5 and 10 Gb/s, respectively. Based on these systems the transmitted data rate is further i...
CMOS ICs Design for Gb/s Optic-Fiber Transmission Systems
CMOS ICs Gb/s Optic-Fiber Transmission Systems
2010/7/15
As tele- and data-communications develop rapidly, optic-fiber networks are widely implemented and the data speeds of the systems are higher and higher. Accordingly, ultra-high speed ICs for different ...
In hybrid integrated circuit mask design, the design quality largely depends on the designer's experience and creativity. It is difficult to completely automate the design process as is done with LSIs...
Low-Value Nickel Resistors Electroless-Plated on “IMST” Substrate for Power Hybrid ICs
Low-Value Nickel Resistors “IMST” Substrate Power Hybrid ICs
2010/12/29
This paper describes a new resistor formation technique, characterized by the use of our unique hybrid IC substrate (IMST substrate) and the electroless nickel plating on it.
The evaluation of variou...