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2021年6月17日，在高性能计算国际会议ICS 2021上，计算机系本科生张晨为第一作者（指导教师：翟季冬）的论文《HyQuas：基于混合分割的GPU量子电路模拟系统》 “HyQuas: Hybrid Partitioner Based Quantum Circuit Simulation System on GPU”（作者：张晨、宋泽宇、王豪杰、融凯源、翟季冬）获得大会唯一最佳学生论文奖。张晨...
The International Chamber of Shipping (ICS) is the principal international trade association for the shipping industry, representing shipowners and operators in all sectors and trades.
HJC-ICS型数字程控用户交换机
用户交换机 数字程控交换机
2008/11/26
该机采用32位微处理机作为中央控制系统，属于国内同类产品中最先进的，从电源到交换网络到中央控制电路，全部采用双机双热备份，一旦工做出现故障，可以自动切换到备用电路，丝毫不影响正常工作，工作可靠。该研究达到了国内先进水平。
Design of High-Speed CMOS Ics for 10 Gbit/s Optical Communication System
Design CMOS Ics Optical Communication System
2010/7/15
In this paper, the intrinsic disadvantages of the nowadays low-cost deep-submicron digital CMOS technologies in respect of the design of high-speed optical communication (OC)
systems front-end integr...
A 30 Gb/s parallel optic-fiber receiver structure is presented. Parallel receiver amplifiers of 12 channels have been designed using TSMC 0.25 μm CMOS technology and for single-channel bit rate of 2.5...
In this paper, progress in compound semiconductor devices and ICs is reviewed.Emphasis is laid on the status of the research and development in our institute in the areas such as GaAs very high speed ...
SiGe Bipolar ICs for 40 Gb/s Fiber-Optic TDM Transmission Systems
SiGe Bipolar ICs 40 Gb/s Fiber-Optic TDM Transmission Systems
2010/7/15
Today, commercial time-division multiplexing (TDM) systems for long-haul optical-fiber links are running at 2.5 and 10 Gb/s, respectively. Based on these systems the transmitted data rate is further i...
CMOS ICs Design for Gb/s Optic-Fiber Transmission Systems
CMOS ICs Gb/s Optic-Fiber Transmission Systems
2010/7/15
As tele- and data-communications develop rapidly, optic-fiber networks are widely implemented and the data speeds of the systems are higher and higher. Accordingly, ultra-high speed ICs for different ...
In hybrid integrated circuit mask design, the design quality largely depends on the designer's experience and creativity. It is difficult to completely automate the design process as is done with LSIs...
Low-Value Nickel Resistors Electroless-Plated on “IMST” Substrate for Power Hybrid ICs
Low-Value Nickel Resistors “IMST” Substrate Power Hybrid ICs
2010/12/29
This paper describes a new resistor formation technique, characterized by the use of our unique hybrid IC substrate (IMST substrate) and the electroless nickel plating on it.
The evaluation of variou...